Thermal damage can be reduced by cooling the specimen with liquid nitrogen during processing.
Designed to suppress the consumption of liquid nitrogen, allowing long cooling periods.
Rapid cooling of the specimen while immersed in liquid nitrogen. Return to room temperature. Designed to allow parts to be detached.
Incorporates a mechanism to allow the process from polishing to observation to be performed without exposing the sample to the air.
Features of IB-19520CCP
Specimen: Galvanized iron steel
Normal milling (without cooling)
Accelerating voltage 4kV
Cooled milling (holder temperature -120°C)
Accelerating voltage 4kV
Using the temperature control mechanism (option) for cooling
Specimen: Si wafer bonding surface
Normal milling(without cooling)
Cooling(holder temperature -150°C)Accelerating voltage 6kV
Cooling temperature control(holder temperature -20°C)Accelerating voltage 6kV
For the Normal milling (without cooling), the bonding agent is deformed by heat damage, and large voids appear. At -150℃, the cooling is excessive, and voids can be seen at the boundary of the bond and the dull side of Si wafer.
There are no voids in the sample prepared with cooling temperature control.
Intermittent process, Cooling and Cooling with temperature control functions handle a variety of work pieces
Process monitor function
The status of the cross-section milling can be monitored in real-time with the CCD camera.
And the magnification can be varied.
Anti-static coating function
An optional ion beam sputter function is available.
Create thin coatings with good granularity.
Ideal for cases requiring pattern recognition, like EBSD.
Planar ion milling holder
The ion beam is irradiated at a low angle relative to the sample, allowing contamination on the surface layer to be removed, as well as smoothing of the surface.
It is also ideal for selective etching.
Cross Section Preparation kit
This is a kit for performing ion beam milling while rotating the sample.
This kit is used with the Planar ion milling holder.
Makes it possible to create cross-sections of samples prone to streaking when milled, such as porous materials, powders and fibers.
|Ion accelerating voltage
|2 to 8kV
|Ion beam width
|500 μm (full width at half maximum)
(The average value over 2 hours, at accelerating voltage: 8 kV, specimen: Si, 100 μm from edge)
|Specimen holder ultimate cooling temperature
|-120°C or less
|Specimen cooling hold time
|8 Hours or more
|Coolant tank capacity
|Approximately 1 L
|Maximum specimen size
|Stage movement range
|X-axis;±6mm, Y-axis; ±2.5mm
|Specimen fixing method
|Specimen milling swing angle
|Monitoring camera magnification
|Approximately ×20 to 100 (6.5-inch display)
|Set the inside of the chamber to a gas environment, cover the transfer vessel with a cap, and encapsulate the specimen into the vessel.
|Touch panel, 6.5-inch display
|Argon gas (flow rate controlled by mass-flow controller)
|Penning vacuum gauge
|Main evacuation pump
|Turbo molecular pump
|Auxiliary evacuation pump
|Dimensions and Masses
|Main unit: Approx. 670mm (W) × 720mm (D) × 530mm (H) , Approx. 73㎏
Rotary pump: Approx. 120mm(W) × 288.5mm(D) × 163mm(H), Approx. 9.3㎏
|Large Specimen Rotation Holder （IB‐11550LSRH)
Mounting Base Specimen Holder（IB‐11560MBSH)
Large Specimen Holder（IB-11570LSH)
Carbon Coating Holder（IB-12510CCH）
|Single phase 100 to 120V±10%, 50/60Hz, 0.6KVA
|100Ω or less
|Pressure; 0.15±0.05MPa（1.0 to 2.0㎏f/cm2）, Purity: 99.9999% or more, (Argon gas, cylinder, and the regulator must be prepared by customer) hose connector; JISB0203Rc１/4
|15 to 25°C
|60% or less
IB-19520CCP CROSS SECTION POLISHER(TM)
IB-10500HMS CROSS SECTION POLISHER™ High Throughput Milling system
JSM-IT800 Schottky Field Emission Scanning Electron Microscope
The JSM-IT800 incorporates our "In-lens Schottky Plus field emission electron gun" for high resolution imaging to fast elemental mapping, and an innovative electron optical control system "Neo Engine", as well as a system of seamless GUI "SEM Center" for fast elemental mapping with a fully embedded JEOL energy dispersive X-ray spectrometer (EDS), as a common platform.
The JSM-IT800 allows for the replacement of the objective lens of the SEM as a module, offering different versions to satisfy various users requirements. With the JSM-IT800, five versions are available with different objective lenses: a hybrid lens version (HL), which is a general-purpose FE-SEM; a super hybrid lens version (SHL/SHLs, two versions with different functions), which enables higher resolution observation and analysis; and the newly-developed semi-in-lens version (i/is, two versions with different functions), which is suited for the observation of semiconductor devices.
Furthermore, the JSM-IT800 can also be equipped with a new Scintillator Backscattered Electron Detector (SBED) and a Versatile Backscattered Electron Detector (VBED). The SBED enables the acquisition of images with high responsiveness and produces sharp material contrast even at a low accelerating voltage, while the VBED can help obtain images of 3D, topography and material contrasts. Thus, the JSM-IT800 can help users to obtain information that was not obtainable and to solve problems in measurement.
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The IB-19530CP features an innovatively designed, multi-purpose stage to fulfill increasingly diversified market needs and realize multi-functionality by different kinds of functional holders. The multi-purpose stage combined with specialized functional holders allows the user to perform various functions such as planar surface milling and polishing, sputter coating as well as more traditional cross-section ion milling.
JSM-7610FPlus Schottky Field Emission Scanning Electron Microscope
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SEM- Essential in Daily Lab Operation JSM-IT700HR Makes it Easy.
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JCM-7000 NeoScope™ Benchtop SEM
Benchtop scanning electron microscopes are used in a wide range of fields, such as electrical, electronics, automobiles, machinery, chemical, and pharmaceutical industries. In addition, SEM applications are expanding to not only cover research and development, but also address quality control and product inspection at manufacturing sites. With this, demands for further improved work efficiency, much faster and easier operation, and a higher degree of analytical and measurement capabilities, are increasing.&lt;br&gt;&lt;br&gt;The JCM-7000 Benchtop Scanning Electron Microscope is designed based on a key concept of "Easy-to-use SEM with seamless navigation and live analysis". The JCM-7000 incorporates three innovative functions; "Zeromag" for smooth transition from optical to SEM imaging, "Live Analysis" for finding constituent elements for an image observation area, and "Live 3D" for displaying a reconstructed live 3D image during SEM observation.&lt;br&gt;&lt;br&gt;When you place the JCM-7000 next to an optical microscope, further-faster and more-detailed foreign material analysis and quality control can be made.