ACE eye™
High Throughput Analytical Electron Microscope

From "operator dependent" to "operator-free measurement"

ACE eye™ is a semiconductor-dedicated TEM that delivers fully automated, end-to-end operation—from TEM/STEM imaging to EDS analysis—through a predefined, recipe-based workflow. By standardizing measurement conditions, it ensures outstanding reproducibility while offering flexible operation modes, ranging from semi-automated to fully automated workflows.
Equipped with AI-driven automatic aberration correction (ASCOR, as a standard) and advanced automation algorithms, ACE eye™ continuously maintains optimal measurement conditions, enabling highly precise, operator-independent results.
In addition, by leveraging proven hardware technologies and a design optimized for long-term stable operation, ACE eye™ delivers the usability and high reliability required for semiconductor analysis.

Features

Automation

• By converting measurement conditions and procedures into standardized recipes, ACE eye™ enables fully automated, end-to-end operation—from TEM/STEM imaging to EDS analysis—within a single workflow, ensuring stable, operator-independent results.

• The system supports a flexible range of automation levels, from semi-automated to fully automated workflows, allowing users to select the optimal configuration based on their measurement objectives and operational requirements.

• ACE eye™ is equipped with ASCOR (by CEOS) as a standard, enabling AI-driven automatic aberration correction. Combined with advanced automation algorithms, it continuously optimizes measurement conditions and maintains peak performance at all times.

• Key parameters—including focus adjustment, astigmatism correction, specimen height alignment, beam centering, and crystal orientation alignment—are automatically controlled to ensure consistent and reliable measurements.

• The combination of a large-capacity liquid nitrogen tank (with a coolant holding time of approximately five days), the optional Automation Center automated measurement software, and the optional MSP (MultiSPECPORTER) enables unattended, long-duration continuous operation, improving measurement efficiency and maximizing system utilization.

Stability

• A robust system design incorporating a wide-gap pole piece and ASCOR (by CEOS) ensures the stable integration of high-resolution imaging and high-sensitivity EDS analysis, providing an optimal observation environment for advanced semiconductor material characterization.

• High magnification reproducibility of ±0.5% is achieved for both TEM and STEM, enabling stable positioning and reliable data acquisition even during a long-duration or fully automated measurements.

• Continuous monitoring of system status and external environmental factors—including magnetic fields, vibration, room temperature, and cooling water temperature—via LogChecker (optional) provides full visibility into the measurement environment and ensures a consistent, stable operation.

• The column enclosure minimizes the impact of external disturbances, further enhancing reproducibility and reliability in automated measurements and high-magnification observations.

Operability

• The intuitive user interface, “TEM Center”, enables a seamless execution from observation to measurement using a mouse, ensuring smooth workflows independent of user experience.

• “Automation Center”, features two dedicated modes—Operator and Administrator—facilitating an efficient configuration and operational management based on user roles.

• Seamless integration with Gatan cameras supports smooth workflows from image acquisition to data storage, enabling high-productivity observation while delivering highly reliable data.

• A newly developed holder enables one-touch loading and removal of specimen grids, simplifying operation, reducing routine workload, and shortening preparation time.

FIB Linkage

• Optional dual-axis tilt cartridges and dedicated TEM holders enable seamless integration between TEM and FIB workflows.

• The cartridge can be attached to the dedicated holder in a single action, eliminating the need for direct handling of TEM grids after specimen preparation. This reduces operator workload while minimizing the risk of specimen damage and contamination.

Specifications

Gallery

LAADF-STEM image

Specimen : Semiconductor device (GAA)
Accelerating voltage : 200 kV

HAADF-STEM image (CD Measurement )

Specimen : Semiconductor device (FinFET)
Accelerating voltage : 200 kV

EDS maps (Net count map)

Specimen : Semiconductor device (FinFET)
Accelerating voltage : 200 kV

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