mechanical polishing
mechanical polishing
"Mechanical polishing" is a physical polishing technique used for specimen preparation of TEM. The common techniques are as follows: (1) Manual polishing using water-resistant paper (down to ～100 μm thick), (2) Rotational polishing device-based polishing using diamond or corundum particles (down to ～several 10 μm thick), (3) Dimple grinder-based polishing using corundum particles (down to <10 μm thick), and (4) Tripot polisher-based polishing using diamond particles (down to <10 μm thick).
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