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JIB-4610F Multi Beam System

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JIB-4610F Multi Beam System

JIB-4610F is an easy-to-use, out-lens type scanning electron microscope (SEM) equipped with a Schottky electron gun, as well as a new FIB column capable of large current processing (maximum ion current 90nA) installed into one chamber. JIB-4610F enables high-resolution SEM observation after high-speed cross-section milling with FIB, and high-speed analysis with a variety of analytical instruments, such as energy dispersive X-ray spectroscopy (EDS) that takes advantage of the Schottky electron gun delivering a large probe current (200nA), electron back scatter diffraction (EBSD) to perform crystallographic characterization, and cathodoluminescence (CLD). In addition, the 3D analysis function Cut & See is included in the standard configuration, allowing cross-section milling to be executed automatically at fixed intervals, while acquiring SEM images for each cross section.

Features

Faster, wider area processing

The adoption of the new FIB column provides a maximum ion current of 90nA at an accelerating voltage of 30kV, achieving resolutions of 4nm.
As a result, even faster processing than that available with the conventional instruments is possible. (More than 1.5 times faster processing than existing instruments (in-house comparison).) This is especially useful for processing large areas (volumes).
It is also possible to remove the damaged-layers due to processing by using an ion beam with a low accelerating voltage, enabling clean, polished surfaces to be obtained.

More accurate analysis

The electron gun column with a maximum probe current of 200nA supports high-speed, high-resolution analysis using techniques like EDS, EBSD and CLD (option). The high-speed analysis also contributes to reducing drift and damage caused by the electron beam. This JEOL-proven Schottky electron gun column enables acquisition of highly-reliable data due to improved electron-beam stability and mechanical stability.

3D observation, 3D analysis

By combining various types of analysis units (options) with a large-current FIB and a high-resolution SEM incorporating a Schottky electron gun, the following functions can be achieved:

Automatic, continuous processing and observation of SEM images using Cut & See.

Automatic, continuous data acquisition of EDS and EBSD mapping.

Stacking and overlapping the continuously acquired images makes it possible to perform various types of three-dimensional observations and analyses (option). Furthermore, the data can be acquired for any type of analysis without tilting or rotating the stage.

An even wider range of applications

By installing a cooling stage and Cryo unit (option), it is possible to reduce thermal damage due to ion-beam irradiation during FIB processing. The Cryo unit is also effective for processing and observing specimens that contain water.

Compatibility with other JEOL products

Since the specimen holders for the JIB-4610F can also be used with the JEOL FE-SEM instruments, specimens can be loaded between instruments without transferring them to a different holder. This allows more efficient observation and processing, with the use of navigation functions to set and find the desired positions for observations and processing (option).
Furthermore, as an option, using a shuttle retainer to ensure compatibility between the TEM holder tip and JIB series stage facilitates mounting the sample, further improving throughput.

Specifications

SEM
Electron gun Schottky Field Emission Type
Objective lens Ultra-conical objective lens
Resolution 1.2nm (@ Vacc: 30kV), 3.0nm (@ Vacc: 1kV)
Accelerating voltage 0.1 to 30kV
Probe current 1pA~200nA
Aperture angle optimizing lens Built-in
Magnification x20~x1,000,000
FIB
ION GUN Ga Liquid Metal Ion Source (LMIS)
Resolution 4 nm (@ Vacc: 30kV)
Magnification ×100~300,000 (Processing) / ×50~300,000 (Observation)
Accelerating voltage 1~30 kV
Probe current 1 pA~90 nA (@ Vacc: 30kV)
Detectors Lower electron detecor
R-BEI (Option)
STEM (option)
Gentle Beam (specimen bias voltage) Built-in (Voltage applied to specimen: 0 to -2,000V)
Specimen exchange chamber Built-in
Specimen stage 6-axis, motor-drive stage
Specimen travel range X;50mm、Y;50mm、Z;1.5~41mm、T(tilt);-5~70°, R (rotation);360°endless, Fz;-3 to +3mm
Specimen exchange method One-touch chucking
Specimen holders Standard holders;φ12.5mm、φ32mm
Optional holders;φ76.2 wafer holder
φ100mm wafer holder
φ125mm wafer holder
φ150mm wafer holder
2, 4, 6 inch bulk holders,
Surface multi-specimen holder,
STEM holder,
Shuttle retainer holder,
One-touch holder
Chamber scope Specimen chamber camera (option)
Auto functions Auto focus
Auto brightness control
System control SEM control system PC
-IBM PC/AT compatible
-RAM 4GB or more
-OS Windows®7 Professional
Monitor 24-inch
ImageDisplay Image display area 1,280×980 pixels or 640×480pixels
(GUI size: 1,600×1,200)
Display modes Standard; SEM_SEI、FIB_SEI、SEM_MIX
Options; SEM_COMPO, SEM_TOPO, SEM_TED, AUX
Scanning/ Display modes Limited area scan, Addition image, Scaler,
Screen display; 1 screen, 2 screen (standard), 4 screen
Ultimate vacuum HV;2.0×10E-4Pa (When GIS is used;<3.0E-3Pa)
Evacuation system SIP×2 (SEM) ,
SIP×1 (FIB),
TMP×1,
RP×1
Energy consumption During ordinary operation approx. 2.0kVA
CO2 emission equivalent Annual CO2 emissions During ordinary operation 4,967kg
Safety devices Protection from loss of vaccum, power failure, water leakage, loss of N2 gas pressure, and leakage current.
Footprint 3,200mm or more × 3,000mm or more
Installation requirements Power Supply
Single Phase 200 V, 50/60 Hz, max. 6kVA, Normal use approx. 2.0kVA
Allowable input power supply fluctuation within ±10%
Grounding terminal 100Ω or less x 1
Cooling water
Supply pipe out.dia. 14 mm x 1, or JIS B 0203 Rc 1/4 x 1
Flow rate 0.5 L/min
Water pressure 0.1 to 0.25 MPa (gauge pressure)
Water temperature 20℃± 5℃
Drain in.dia. 25 mm or more x1, or JIS B 0203 Rc 1/4 x 1
Dry nitrogen gas
JIS B 0203 Rc 1/4 (provided by user)
Pressure 0.45 to 0.55 MPa (gauge pressure)
Installation Room
Room temperature 20℃±5℃
Humidity 60% or lower
Stray magnetic field 0.3μT (P-P) or less (50/60 Hz sine wave)*1
Floor vibration 2μm (P-P) or lower*1 at frequency of sine wave more than 5Hz. *1
Noise 70 dB or lower *1 for FLAT characteristic
Dimension of installation room 3,000 mm x 3,000 mm or more
Height 2,300 mm or higher
Door size 1,000 mm *2 (w) x 2,000 mm(H) or more
  • This may not apply for conditions other than these. An installation room survey is conducted before delivery, and the user will be consulted about the maximum magnification of observation.

  • Please inquire if door width is 900 mm.

Main options GIS (C, W, Pt), EDS, WDS, EBSD, CL, Cryo, Chamber camera, SNS, etc.
  • Windows is a registered trademark of Microsoft Corporation in the United States and other countries.

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Application JIB-4610F

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