dimple grinder
dimple grinder
"Dimple grinder" is a mechanical polishing device. It creates a dimple (dip) with a thickness down to 10 μm or less on a parallel plate specimen prepared by polishing using a rotational polishing device (thickness: 100 μm or less). It uses a polishing agent, such as corundum particles having different particle sizes (0.1 μm to several μm). The specimen with the dimple is further thinned by ion milling.
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