SB-89010EUVC
EXCIMER UV CLEANER（FOR WAFER）
Features
6 inch wafer loadable
Wafer surface cleaning before resist coating
Removal of organic matter from wafer surface
Improve adhesion between resist and wafer (*depending on the type of resist or developer, adhesion may not improve).
Minimize ozone generation as much as possible because it is in a vacuum,
ozone generation amount : 0.0012mg/min,
less than 0.01ppm around the equipment.
The Excimer UV Cleaner can eliminate contamination caused by organic substances on the wafer surface, by using UV light with a wavelength of 172 nm emitted from xenon(Xe) excimers.
Removal of Resist Scum
By performing a cleaning step before the etching process, any resist scum remaining on the wafer surface can be removed.
Before cleaning
400 nm thick positive resist
After cleaning
Irradiated for 20 minutes
Please refer to this section for the mechanism of specimen cleaning and hydrophilic treatment using an excimer UV cleaner.
Specifications
| Irradiated UV light | Wavelength 172 nm | ||
|---|---|---|---|
| Maximum specimen size | W 152.4 mm × D154.2 mm ×H 60 mm | ||
| Maximum specimen mass | 1 kg | ||
| Irradiation time setting | 10 seconds to 99 minutes | ||
| Vacuum pump | Diaphragm type dry vacuum pump | ||
| Installation requirements | Power | Single phase, 90 to 110 V AC, 50/60 Hz, 500 VA | |
| Dimensions and weight (cables and vacuum pipes not included) |
Main unit | 43 cm (W) × 44 cm (D) × 31 cm (H), approximately 22 kg | |
| Vacuum pump |
17 cm (W) × 33 cm (D) × 20 cm (H), approximately 8 kg | ||
| Room temperature | 15 to 30 ℃ | ||
| Humidity | 60% (RH) or less (no condensation) | ||
| Regular replacement parts (replace them every time cumulative irradiation time reaches 1000 hours) | UV lamp, vacuum gauge, O-ring, etc. | ||
※ Note: Specifications are guaranteed when no modification or addition is made and are subject to change without notice.
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