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   PRODUCTS : Sample Preparation Equipment : Cross Section Polisher  
Sample Prep.
Products
  
IB-09010CP Cross Section Polisher

Innovative cross section sample preparation device, combining JEOL's sophisticated technologies and expertise in applications.

  • For samples too sensitive for mechanical polishing
    For soft, hard, and composite samples
  • Excellent mirror finish
    Minimum distortion of samples; ideal for preliminary processing of samples for crystal orientation analysis (EBSD)
  • Large cross sections 1 mm wide
    Suitable for failure analysis of plated items and electronic devices
  • Easy to use operation panel

Features

  • Color LC operation panel
    Milling conditions loaded by easy operation of LC operation panel
     
  • CCD camera for sample position monitoring (standard)
    Easy sample positioning/monitoring
     
  • Ion accelerating voltage: Max. 8 kV (option)
    For enhanced milling speed
    Max. 6 kV (standard)
     

  
SEM Samples

Paper

Cutting paper with a knife often damages paper fiber.

Paper
Cutting paper with a knife often damages paper fiber.
Cutting paper with a knife often damages paper fiber.


CP can create cross sections with minimum damage on fiber.

CP can create cross sections with minimum damage on fiber.

CP can create cross sections with minimum damage on fiber.


Gold wire bonding

CP creates cross sections of soft materials such as gold with minimum damage. It is suitable for analysis of void at bonding contact. Conventional mechanical polishing often causes void damage, particle infiltration into gold, interface detachment, and scratches. CP can create cross sections free from artifacts.

Gold wire bonding
CP creates cross sections of soft materials such as gold with minimum damage. It is suitable for analysis of void at bonding contact. Conventional mechanical polishing often causes void damage, particle infiltration into gold, interface detachment, and scratches. CP can create cross sections free from artifacts.
CP creates cross sections of soft materials such as gold with minimum damage. It is suitable for analysis of void at bonding contact. Conventional mechanical polishing often causes void damage, particle infiltration into gold, interface detachment, and scratches. CP can create cross sections free from artifacts.


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Cross Section Polisher IB-09010CP Specifications
Ion accelerating voltage 2 to 6 kV (8kV:option)
Ion beam size 500 µm or more (FWHM)
Milling speed

More than 100 µm/h (6kV),More than 300 µm/h (8kV)

Maximum specimen size 20 mm (W) x 10 mm (L) x 5 mm (T):option
Specimen movement X: ±10 mm; Y: ±3 mm
Rotation angle ±5°
Swing angle ±30°
Operation Touch panel
Gas Ar gas (flow control by mass flow controller)
Pressure reading Penning gauge
Major evacuation Turbo molecular pump
Auxiliary evacuation Rotary pump
Dimensions and weight 545 mm (W) x 550 mm (D) x 420 mm (H), 64kg
Rotary pump 150 mm (W) x 427 mm (D) x 230.5 mm (H), 16kg
Optional accessories Accelerating voltage 8 kV unit
Specimen rotation holder
High precision CCD camera for positioning
  
Cross Section Polisher IB-09010CP Installation Requirements
Power supply Single phase 100 to 120 V±10%, 50/60 Hz, 0.5 to 0.6 kVA
Ground Type D (100 ohm or less)
Argon gas Pressure: 0.15±0.05 MPa (1.0 to 2.0 kg/cm²)
Purity 99.999% or more (Argon gas, gas cylinder, and regulator provided by user)
Hose fitting: JIS B0203 Rc ¼
Room temperature 20 to 25°C (fluctuation: Within 1°C/h)
Humidity 60% or less
  

Please Note

Not all JEOL products are available in every country. For specific information and more details about JEOL products available in your area, contact your local JEOL office or sales representative. Thank you.

  

 
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