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JIB-4601F MultiBeam System
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 All in one tool - Various applications are offered with one instrument:
- Optimum-geometry specimen chamber for all functions of FIB milling, SEM imaging, and EDS/EBSD analyses
- High-accuracy thin-film preparation achieved by combination with high-resolution SEM
- Fast wide-area milling with large FIB ion-beam current up to 60 nA
- Installation of up to 3 gas guns for protective-film creation and wiring modification
- Real-time monitoring of the progress of FIB milling observed by high-resolution SEM
- High-speed analysis with large probe current up to 200 nA by a robust thermal FEG
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FIB
| Ion source |
Ga liquid metal source |
| Accelerating voltage |
1 to 30 kV (in steps) |
| Magnification |
30x (for searching field)
100 to 300,000x |
| Image resolution |
5 nm (at 30 kV) |
| Beam current |
Up to 60 nA (at 30 kV) |
| Movable aperture |
12 steps (motor driven) |
| Ion beam shapes during milling |
Rectangle, Line, Spot, and BMP |
SEM
| Accelerating voltage |
0.2 to 30 kV (in steps) |
| Magnification |
20 to 1,000,000x |
| Image resolution |
1.2 nm (at 30 kV)
3.0 nm (at 1 kV) |
| Beam current |
200 nA |
| Specimen stage |
Goniometer stage
X: 50 mm; Y: 50 mm; Z: 1.5 to 40 mm; T: -5 to 70°; R: 360° |
| Vacuum pump |
SIP x2 (SEM), x1 (FIB)
TMP x1, RP x1 |
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JIB-4601F Optional Attachments
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- EDS (Energy Dispersive X-ray Spectrometer)
- EBSD (EBSD System)
- CLD (Cathodoluminescence Detector)
- IRCAM (IR Camera for Specimen Chamber)
- GIS (Gas Injection System)
- PCD (Probe Current Detector)
- AEM (Absorbed Current Meter)
- TED (Transmission Electron Detector)
- BEI (Backscattered Electron Detector)
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